Introduction to IC Tag Encapsulation Molding Technology
Achieves low-cost sealing without putting pressure on tag elements that are sensitive to moisture and heat.
We propose a sealing molding technology for IC tags. Utilizing stable resin adhesion, we offer structural proposals and molded products that contribute to miniaturization and lightweight design of products. 【Features】 ■Molding ... Hollow/filling molding, two-color/one-shot molding ■Waterproofing ... Airtight thermal welding ■Heat resistance ... Use of super heat-resistant engineering plastics ◎ By selecting the optimal structural design and processing method, we achieve low-cost sealing without applying stress to tag elements that are sensitive to moisture, heat, and mechanical stress. For more details, please contact us or download the catalog.
- Company：コソフ 営業部
- Price：Other
